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Polyamide hot-melt adhesive



      Polyamide hotmelt adhesive is made of Dimer Acid and diamine via polycondensation reaction, has high bond strength, flexibility, good resistance to medium.
     Shape: light yellow granular or powder solids.
Features: has good solubility and solubility at low temperature, high thermal stability and flexibility.
Uses: bonding of clothing, shoes, leather, plastic, metal electronic components.
     Typical index:

Acid value mgKOH/g Amine value mgKOH/g viscosity mpa s/25℃ Softening point ℃ Chroma Fe-CO
≤5 ≤5 150-500 105-125 ≤7

      Packing: 3-in-1 paper bag. Net wt 25(±0.2)kg.
      Storage: Kept in cool and dry place. Avoid high temperature, insolation and rain during transportation.




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